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The Sniper II is a BGA and Micro BGA Rework system. One side of the Sniper removes the device, the other side selects a replacement component; a monitor reflects the image of the bottom of the chip and the footprint on the board. These are then adjusted to exactly overlay each other and the component placed automatically. The part is then reflowed.
Model No
SNIPER
Condition
Used
Manufacturer
APE